VL-COMm-33 Rugged COM Express Mini | VersaLogic

VL-COMm-33

Notice: The VL-COMm-33 has reached the end of its off-the-shelf availability. Contact VersaLogic Sales for availability and extended lifecycle options.

An extremely small and rugged Computer on Module (COM) based on the industry-standard COM Express mini form factor. Roughly the size of a credit card, the VL-COMm-33 has been engineered to meet the requirements of aviation, defense, industrial control, and medical applications while adhering to stringent regulatory standards.

  • Intel Atom "Bay Trail" Processor

    Quad, dual or single core versions

  • COM Express Mini Form Factor

    Extremely small (55 mm x 84 mm) with Type 10 pin-out

  • Combine it with a carrier

    See EPU-3310/11/12 or contact us for custom options

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Specifications

See datasheet for more details

Mechanical Size: COM Express mini: 55 x 84 mm (2.17 x 3.31")
Mechanical Weight: 31g (1.09 oz.)
Processor Intel Bay Trail Atom (single, dual, or quad core)
Input Voltage 4.75V–20VDC
Power (typical) 3.5 - 7.3W depending on model
Bus Expansion Three x1 PCIe (Gen 2) lanes
Bus Expansion SMBus
Operating Temperature -40° to +85°C
Shock and Vibration MIL-STD-202G
Memory (RAM) 2 GB or 4 GB of soldered-on DDR3L SDRAM
Display Intel Gen-7 graphics
Display Single-channel LVDS interface
Display 1x DDI (Digital Display Interface) 
Storage Two SATA 3 Gb/s ports
Ethernet One 1GbE port (10/100/1000 autodetect)
USB One USB 3.0 host port. Six USB 2.0 host ports.
Serial I/O Two COM ports
Digital I/O -
Audio High Definition Audio (HDA)
Other I/O Single I2C
Other I/O GPIO
Other I/O SPI 
Operating System Compatibility Most x86 operating systems including Windows, Windows Embedded, Linux and VxWorks
Export Info ECCN: 5A992.c
Export Info Schedule B: 8471.60.7000

See datasheet for full specifications

Description

The VL-COMm-33 is an extremely small and rugged Computer on Module (COM) based on the industry-standard COM Express mini form factor. Roughly the size of a credit card, the VL-COMm-33 has been engineered to meet the requirements of aviation, defense, industrial control, and medical applications while adhering to stringent regulatory standards. Equipped with an Intel Atom Bay Trail E38xx processor, it is designed to withstand extreme temperature, impact, and vibration.

Available in single, dual, and quad core versions, the COMm-33 provides extreme performance for its size. It does so at moderate power consumption (3.5 to 7.25W typical), in a very small package. The COMm-33 provides compatibility with a broad range of standard x86 application development tools for reduced development time.

The VL-COMm-33 utilizes advanced Intel technologies to maximize performance. Intel Virtualization Technology allows one VL-COMm-33 system to function as multiple virtual platforms. This enables computing activities to be isolated into separate partitions for increased application flexibility and reliability. Intel 64 architecture delivers 64-bit computing when combined with supporting software.

The integrated Intel Gen-7 graphics core provides hardware-accelerated MPEG-4/H.264 and MPEG-2 video encoding and decoding. A standard LVDS output supports flat panel displays. An SDVO output supports a variety of signaling interfaces including VGA and DVI.

The standard COM Type 10 pin-out provides industry-standard system interfaces that include Gigabit Ethernet with network boot capability, a single USB 3.0/2.0 and six USB 2.0 ports, two serial ports, Intel High-Definition Audio (HDA), LPC, I2C, SPI, and SMBus to the carrier board. A dual SATA 3 Gb/s interface supports high-capacity storage. Optional on-board eMMC memory supports up to 8 GB of Flash.

Designed and tested for industrial temperature (-40º to +85ºC) operation, the rugged VL-COMm-33 also meets MIL-STD-202G specifications for shock and vibration. Soldered-down RAM provides additional ruggedization for use in extremely harsh environments.

The VL-COMm-33 is supported by a variety of thermal heat dissipation solutions, including a standard heat plate, heat sink, fan for heat sink, heat pipe, and other cooling / mounting solutions.

A wide input voltage range of 4.75 to 20 volts simplifies system power supply requirements. It is fully compatible with 12V automotive-type power systems.

The VL-COMm-33 is backed by a five-year warranty, 10+ year availability, and expert US-based technical support.

Product customization is available, even in low quantities. Options include conformal coating, splash screen configuration, application-specific testing, BOM revision locks, special labeling, etc.

A compatible carrier card is required for operation of this COM module. Contact VersaLogic for custom designed carrier boards that meet your exact requirements. Please contact a VersaLogic Sales Engineer for more information.

VersaLogic products are designed for use by OEMs working in a variety of market applications: Aerospace, Defense, Energy, Industrial, Security, Medical, Military, Robotics, and Transportation. VersaLogic delivers extremely reliable standard and customized embedded computers backed with unsurpassed service and the highest availability in the market.

Accessories

Hardware VL-HDW-410A  Heat Plate Kit to mount COMm-33 Module, 6 mm tall, includes: Thermal Interface Material, Mounting Screws x4, HDW-401 Thermal compound paste. VL-HDW-410B  Heat Plate to mount to COMm-33 module, 6 mm tall, includes Thermal Interface Material VL-HDW-406  Passive Heat Sink. Mounts to product’s heat plate. 55 x 84 x 16mm    Icon Photo VL-HDW-411  Cooling fan for HDW-406 passive heat sink, 12V    Icon Photo VL-HDW-405  Secondary mounting plate. – Flat. 75 x 84 mm. Simplifies installation in many situations. Attaches to heat plate on standard product.    Icon Photo VL-HDW-408  Heat Pipe system. Mounts to product’s heat plate. 55 x 84 x 8.2mm    Icon Photo VL-HDW-401  Thermal compound paste. For attaching heat plates and sinks.    Icon Photo
  • Part Number Description
  • Hardware
  • VL-HDW-410A Heat Plate Kit to mount COMm-33 Module, 6 mm tall, includes: Thermal Interface Material, Mounting Screws x4, HDW-401 Thermal compound paste.
  • VL-HDW-410B Heat Plate to mount to COMm-33 module, 6 mm tall, includes Thermal Interface Material
  • VL-HDW-406 Passive Heat Sink. Mounts to product’s heat plate. 55 x 84 x 16mm Icon Photo
  • VL-HDW-411 Cooling fan for HDW-406 passive heat sink, 12V Icon Photo
  • VL-HDW-405 Secondary mounting plate. – Flat. 75 x 84 mm. Simplifies installation in many situations. Attaches to heat plate on standard product. Icon Photo
  • VL-HDW-408 Heat Pipe system. Mounts to product’s heat plate. 55 x 84 x 8.2mm Icon Photo
  • VL-HDW-401 Thermal compound paste. For attaching heat plates and sinks. Icon Photo

Models

Model:    VL-COMm-33EA Processor:    Atom E3815 CPU Cores:    1 Speed:    1.46 GHz RAM:    2 GB eMMC Flash:    None Buy Sample:    -
Model:    VL-COMm-33EB Processor:    Atom E3827 CPU Cores:    2 Speed:    1.75 GHz RAM:    2 GB eMMC Flash:    4 GB Buy Sample:    -
Model:    VL-COMm-33ED Processor:    Atom E3845 CPU Cores:    4 Speed:    1.91 GHz RAM:    4 GB eMMC Flash:    8 GB Buy Sample:    -

Models

  • Model Processor CPU Cores Speed RAM eMMC Flash Buy Sample
  • VL-COMm-33EA Atom E3815 1 1.46 GHz 2 GB None -
  • VL-COMm-33EB Atom E3827 2 1.75 GHz 2 GB 4 GB -
  • VL-COMm-33ED Atom E3845 4 1.91 GHz 4 GB 8 GB -