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VL-COMm-33

VL-COMm-33COM Express Mini CPU Module - Atom

COM Express Mini CPU Module - Atom "Bay Trail"

Industrial temperature high-performance CPU module.

Highlights

  • COM Express Mini Form Factor
    Extremely small (55 mm x 84 mm) with Type 10 pin-out.
  • Intel Atom "Bay Trail" Processor
    High performance CPU in quad-, dual- or single-core versions. Low power consumption.
  • Industrial Temperature Operation
    Rated -40° to +85°C for harsh environments.
  • MIL-STD-202G
    Qualified for high shock / vibration environments.
  • Wide Input Voltage Range
    Accepts 4.75 to 20 volts (nominal 12V input)
  • High-performance Video
    Integrated Intel Gen 7 graphics core supports DirectX 11, OpenGL 4.0, and H.264, MPEG-2 encoding/decoding. LVDS video output.
  • Network
    Gigabit Ethernet (GbE) with remote boot support.
  • RAM
    Up to 4 GB soldered-down RAM.
  • I/O Interfaces
    SATA, PCIe, USB 3.0, USB 2.0, GPIO, serial, HD audio, LPC, SMBus SPI, and I2C.
  • Flash Memory
    Up to 8 GB of on-board eMMC flash storage.


Software Expertise: Reference & Software Expertise

OS Compatibility: Win 10 Windows/Win 8/Win 7/Win XP, Windows Embedded Win Std 7/Win XPe/Win CE, Linux, Wind River, QNX, DOS

RoHS-compliant

Description

Overview

The VL-COMm-33 is an extremely small and rugged Computer on Module (COM) based on the industry-standard COM Express mini form factor. Roughly the size of a credit card, the VL-COMm-33 has been engineered to meet the requirements of aviation, defense, industrial control, and medical applications while adhering to stringent regulatory standards. The VL-COMm-33 is manufactured to IPC-A-610 Class 2 standards. Equipped with an Intel Atom Bay Trail E38xx processor, it is designed to withstand extreme temperature, impact, and vibration.

Available in single, dual, and quad core versions, the COMm-33 provides extreme performance for its size. It does so at moderate power consumption (3.5 to 7.25W typical), in a very small package. The COMm-33 provides compatibility with a broad range of standard x86 application development tools for reduced development time.

The VL-COMm-33 utilizes advanced Intel technologies to maximize performance. Intel Virtualization Technology allows one VL-COMm-33 system to function as multiple "virtual" platforms. This enables computing activities to be isolated into separate partitions for increased application flexibility and reliability. Intel 64 architecture delivers 64-bit computing when combined with supporting software.

The integrated Intel Gen-7 graphics core provides hardware-accelerated MPEG-4/H.264 and MPEG-2 video encoding and decoding. A standard LVDS output supports flat panel displays. An SDVO output supports a variety of signaling interfaces including VGA and DVI.

The standard COM Type 10 pin-out provides industry-standard system interfaces that include Gigabit Ethernet with network boot capability, a single USB 3.0/2.0 and six USB 2.0 ports, two serial ports, Intel High-Definition Audio (HDA), LPC, I2C, SPI, and SMBus to the carrier board. A dual SATA 3 Gb/s interface supports high-capacity storage. Optional on-board eMMC memory supports up to 8 GB of Flash.

Designed and tested for industrial temperature (-40º to +85ºC) operation, the rugged VL-COMm-33 also meets MIL-STD-202G specifications for shock and vibration. Soldered-down RAM provides additional ruggedization for use in extremely harsh environments.

The VL-COMm-33 is supported by a variety of thermal heat dissipation solutions, including a standard heat plate, heat sink, fan for heat sink, heat pipe, and other cooling / mounting solutions.

A wide input voltage range of 4.75 to 20 volts simplifies system power supply requirements. It is fully compatible with 12V automotive-type power systems.

The VL-COMm-33 is backed by a five-year warranty, 5+ year off-the-shelf availability guarantee, and expert US-based technical support. Product Life Extension options support availability through the year 2025.

Product customization is available, even in low quantities. Options include conformal coating, splash screen configuration, application-specific testing, BOM revision locks, special labeling, etc.

A compatible carrier card is required for operation of this COM module. Contact VersaLogic for custom designed carrier boards that meet your exact requirements. Please contact a VersaLogic Sales Engineer for more information.

VersaLogic products are designed for use by OEMs working in a variety of market applications: Aerospace, Defense, Energy, Industrial, Security, Medical, Military, Robotics, and Transportation. Anywhere that the need for superb quality and high-performance embedded computing exists, applications include: automation, avionics, gateway, in-vehicle, monitoring, simulation, and vision.

VersaLogic delivers extremely reliable standard and customized embedded computers backed with unsurpassed service and the highest availability in the market. VersaLogic exists to exceed customers' product, service, support and delivery needs - whenever and wherever the need arises.

Specifications

General Form Factor COM Express mini (Type 10)
Board Size 55 mm x 84 mm (2.17" x 3.31")
Weight 31 grams (1.09 oz.)
Processor Intel Atom E38xx platform. 512K 8-way L2 cache per core. Intel 64-bit instructions, Virtualization Technology (VT), and new AES instructions.
Power Requirements
(@ +12V) §
Model Idle Typical Max. S3
VL-COMm-33EAP 2.5W 3.5W 4.5W 0.4W
VL-COMm-33EBP 3.5W 5.6W 8.0W 0.4W
VL-COMm-33EDP 3.5W 7.3W 11.0W 0.4W
Input Voltage 4.75V–20V (nominal 12V operation)
System Reset & Hardware Monitors Voltage rails monitored. Watchdog timer with programmable timeout (1 µS to 10 min.).
Manufacturing Standards IPC-A-610 Class 2
Regulatory Compliance RoHS (2011/65/EU)
Environmental Operating Temperature -40°C to +85°C.
Derate -1.1°C per 305m (1,000 ft.) above 2,300m (7,500 ft.) ¤
CPU die must be kept below 90°C
Storage Temperature -40°C to +85°C.
Cooling Thermal solution required. CPU die must be kept below 90°C.
See heat plate, heat sink, fan, and heat pipe options.
Airflow All models 100 LFM (30 LMM)
LFM = Linear Feet per Minute
LMM = Linear Mters per Minute
Altitude ¤
Operating To 4,570m (15,000 ft.)
Storage To 12,000m (40,000 ft.)
Thermal Shock 5°C/min. over operating temperature
Humidity Less than 95%, noncondensing
Vibration, Sinusoidal Sweep ¥ MIL-STD-202G, Method 204, Modified Condition A: 2g constant acceleration from 5 to 500 Hz, 20 min. per axis
Vibration, Random ¥ MIL-STD-202G, Method 214A, Condition A: 5.35g rms, 5 min. per axis
Mechanical Shock ¥ MIL-STD-202G, Method 213B, Condition G: 20g half-sine, 11 msec. duration per axis
Memory System RAM 2 GB or 4 GB of soldered-on DDR3L SDRAM. 1333 MT/s.
Video General Integrated high-performance video. Intel Gen-7 graphics core with 4 Execution Units and Turbo Boost. Supports DirectX 11, OpenGL 4.0, VP8, MPEG2, H.264, and VC1.
VRAM Up to 224 MB shared DRAM
Desktop Display Interface π 1x DDI (Digital Display Interface) with support for
  • 1x DisplayPort 1.1. Multiplexed with HDMI/DVI ports. Supports Hot-Plug detect.
  • 1x HDMI 1.4 port. Multiplexed with DisplayPort (DP)/DVI. Supports Hot-Plug detect
  • 1x DVI port. Multiplexed with HDMI/DP ports. Supports Hot-Plug detect.
OEM Flat Panel Interface π Single-channel LVDS interface. 18/24-bit. Up to 1920 x 1200 (60 Hz).
Mass Storage Rotating Drives / Flash / SSD ‡ Two SATA 3 Gb/s ports π
Optional eMMC 4.5 onboard flash up to 8 GB MLC
Network Interface Ethernet † π One autodetect 10BaseT/100BaseTX/1000BaseT port. Network boot option.
Type 10 I/O Interfaces USB 3.0/2.0 ‡ π One host port
USB 2.0 ‡ π Six host ports
COM 1 / 2 π Two-wire, CMOS levels. 16C550 compatible. 3 Gbps max.
GPIO π 4 lines multiplexed with the SD card interface
Audio π High Definition Audio (HDA)/digital audio interface with support for multiple codecs.
PCIe π Three x1 PCIe (Gen 2) lanes
SMBus π 1 MHz
LPC π 33 MHz
SPI π Supports alternative BIOS flash device only.
I2C π Fast mode multi-master I²C Bus
Control π Wake, reset, and power
Software BIOS AMI Aptio UEFI BIOS with OEM enhancements. Field reprogrammable.
Sleep Mode ACPI 3.0. Support for S3 suspend state.
Operating Systems Compatible with most x86 operating systems including Windows, Windows Embedded, Linux, and VxWorks
§Represents operation at +25°C with +12Vsupply running Windows XP with LVDS display, SATA, GbE, COM, and USB keyboard/mouse. Typical power computed as the mean value of Idle and Maximum power specifications. Maximum power measured with 95% CPU utilization.
† IEEE 1588 Precision Time Protocol (PTP) compatible
‡ Bootable storage device
π Available via Type 10 I/O connector
¤ Extended altitude specifications available upon request
¥ MIL-STD-202G shock and vibe levels are used to illustrate the extreme ruggedness of this product in general. Testing to higher levels and/or different types of shock or vibration methods can be accommodated per the specific requirements of the application. Contact a VersaLogic Sales Engineer for further information.
Specifications are subject to change without notification. Intel and Atom are trademarks of Intel Corp. COM Express is a trademark of PICMG. PCI Express is a registered trademark of PCI-SIG. All other trademarks are the property of their respective owners.

Software Support Packages


Linux Ubuntu
  • Ubuntu Home Page -
    Link to the Ubuntu website OS download page. Note that the EPMe-30 Bengal has been tested by VersaLogic with Ubuntu Linux 14.04 LTS 32-bit and 64-bit operating systems.

Linux Knoppix
  • Knoppix Home Page -
    Link to the Knoppix website OS download page. Note that compatibility with the EPMe-30 Bengal has been verified by VersaLogic with Knoppix Linux 7.4.2.

Operating System Compatibility

Win 10 - Meets Specifications
Win 8 - Meets Specifications
Win 7 - Tested & Compatible
Win XP - Tested & Compatible
Win Std 7 - Tested & Compatible
Win XPe - Meets Specifications
Win CE - Meets Specifications
Debian - Tested & Compatible
Ubuntu - Tested & Compatible
Knoppix - Tested & Compatible
VxWorks - Meets Specifications
Neutrino - Meets Specifications
DOS - Meets Specifications

OS Compatibility Notes

  • Win 7 - Tested on Windows 7 (32-bit/SP1/Ultimate Edition)
  • Win 7 (64) - Tested on Windows 7 (64-bit/SP1/Ultimate Edition)
  • WES 7 - Tested on Windows Embedded Standard 7 (32-bit/SP1) Tested on Windows Embedded Standard 7 (64-bit/SP1)
  • WES 7 (64) - Tested on Windows Embedded Standard 7 (64-bit/SP1)
  • Tested on Ubuntu Linux 14.04 32-bit
  • Tested on Ubuntu Linux 14.04 64-bit
  • Tested on Knoppix v7.4.2

Accessories

Part Number Description Photo
Hardware
VL-HDW-410AHeat Plate Kit to mount COMM-33 Module, 6 mm tall, includes: Thermal Interface Material, Mounting Screws x4, HDW-401 Thermal compound paste.
VL-HDW-410BHeat Plate to mount to COMM-33 module, 6 mm tall, includes Thermal Interface Material
VL-HDW-406Passive Heat Sink. Mounts to product’s heat plate. 55 x 84 x 16mm
VL-HDW-411Cooling fan for HDW-406 passive heat sink, 12V
VL-HDW-405Secondary mounting plate. – Flat. 75 x 84 mm. Simplifies installation in many situations. Attaches to heat plate on standard product.
VL-HDW-408Heat Pipe system. Mounts to product’s heat plate. 55 x 84 x 8.2mm
VL-HDW-401Thermal compound paste. For attaching heat plates and sinks.

Ordering Information

Model Processor CPU Cores Speed RAM eMMC Flash Digi-Key logo
VL-COMm-33EA Atom E3815 1 1.46 GHz 2 GB None
VL-COMm-33EB Atom E3827 2 1.75 GHz 2 GB 4 GB
VL-COMm-33ED Atom E3845 4 1.91 GHz 4 GB 8 GB


Export Information

Description Value
ECCN:5A992.c
SCHEDULE B:8471.60.7000