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VL-COMm-26

COM Express Mini CPU Module

Extremely small and rugged embedded CPU module.

Highlights

  • COM Express Mini Form Factor
    Extremely small 55 mm x 84 mm format with Type 10 pin-out.
  • Intel Atom E6x0T Processor
    1.6 GHz performance. Low power consumption.
  • Industrial Temperature Operation
    -40 to +85C operation for harsh environments.
  • Class 3 Manufacturing (optional)
    For applications where extreme reliability is essential.
  • MIL-STD-202G
    Qualified for high shock/vibration environments.
  • Trusted Platform Module (optional)
    On-board security option defends against attacks from unauthorized hardware and software.
  • Fanless Operation
    No moving parts required for CPU cooling.
  • Wide Input Voltage Range
    Accepts 8 to 17 volts (12V typ.).
  • High-performance Video
    Graphics core supports MPEG-4/H.264 and MPEG-2 encoding and decoding.
  • Network
    Gigabit Ethernet (GbE) with remote boot support.
  • RAM
    Up to 2 GB soldered-on DDR2 RAM.
  • I/O Interfaces
    SATA, PCIe, USB host/client, serial, HD audio, LPC, SMBus, and CAN.
  • Flash Memory
    On-board microSD socket and SDIO interface for plug-in flash storage.

OS Compatibility: Windows 7

View detailed compatibility information

Description

Overview

The VL-COMm-26 is an extremely small and rugged Computer on Module (COM) based on the industry-standard COM Express mini form factor. Roughly the size of a credit card, the VL-COMm-26 has been engineered to meet the military and medical industries requirements for smaller, lighter, and lower power embedded systems while adhering to stringent regulatory standards. The VL-COMm-26 is manufactured to IPC-A-610 Class 2 standards. For extremely-high-reliability applications, IPC-A-610 Class 3 (modified) versions are available. This embedded computer module, equipped with an Intel Atom E6x0T processor, is designed to withstand extreme temperature, impact, and vibration.

Details

Driven by an Intel Atom E6x0T processor, the VL-COMm-26 provides significant performance and lower power consumption (7W8W typical) in a very compact package. The VL-COMm-26 provides compatibility with a broad range of standard x86 application development tools for reduced development time.

The VL-COMm-26 utilizes advanced Intel technologies to maximize performance. Intel Hyper-Threading Technology (Intel HT Technology) provides two processing threads per physical core which allows applications to work in parallel and complete tasks sooner. Intel Virtualization Technology allows one VL-COMm-26 system to function as multiple virtual platforms. This enables computing activities to be isolated into separate partitions for increased application flexibility and reliability. Enhanced Intel SpeedStep Technology enables high performance while meeting the power-conservation needs of embedded systems by switching voltage and frequency levels in response to processor load.

The integrated Intel GMA600 graphics core provides hardware-accelerated MPEG-4/H.264 and MPEG-2 video encoding and decoding. A standard LVDS output supports flat panel displays. An SDVO output supports a variety of signaling interfaces including VGA and DVI.

The standard Type 10 pin-out provides industry-standard system interfaces including Gigabit Ethernet with network boot capability, seven USB ports, three x1 PCIe lanes, two serial interfaces, Intel High-Definition Audio (HDA), LPC, and SMBus to the carrier board. An auxiliary board-to-board connector provides two additional serial interfaces and a CAN interface. Dual SATA 3 Gb/s interfaces support high-capacity storage. A microSD socket provides flexible solid-state drive (SSD) options.

For enhanced security, the VL-COMm-26 supports Execute Disable Bit functionality. This hardware-based security feature reduces exposure to viruses and malicious-code attacks by preventing harmful software from executing and propagating on the network. An optional on-board Trusted Platform Module (TPM) is available for applications that require additional hardware-level security functions.

Designed and tested for industrial temperature (-40 to +85C) operation, the rugged VL-COMm-26 also meets MIL-STD-202G specifications for shock and vibration. Soldered-on RAM provides additional ruggedization for use in extremely harsh environments. Heatsink or heat plate versions provide fanless heat dissipation. Thermal monitoring technologies protect the system from thermal failure by reducing power consumption when required to remain within normal thermal operating limits.

A wide input voltage range of 8 to 17 volts (12V typ.) simplifies system power supply requirements. It is fully compatible with 12V automotive-type power systems.

The VL-COMm-26 is compatible with a variety of popular x86 operating systems including Windows, Windows Embedded, Linux, and VxWorks.

Product customization is available, even in low quantities. Options include a Trusted Platform Module, conformal coating, BGA underfill, IPC Class 3 (modified) construction, BIOS/splash screen configuration, application-specific testing, BOM revision locks, special labeling, etc.

As a mate to the VL-COMm-26, VersaLogic can design and manufacture carrier boards that meet your exact requirements for an embedded system. Please contact a VersaLogic Sales Engineer for more information.

Ordering Information
Model Processor Speed RAM Cooling
VL-COMm-26EAP* Atom E620T 0.6 GHz 512 MB Heat plate
VL-COMm-26EBP Atom E640T 1.0 GHz 1 GB Heat plate
VL-COMm-26ECP Atom E680T 1.6 GHz 1 GB Heat plate
VL-COMm-26EDP* Atom E680T 1.6 GHz 2 GB Heat plate
VL-COMm-26EAK* Atom E620T 0.6 GHz 512 MB Heatsink
VL-COMm-26EBK Atom E640T 1.0 GHz 1 GB Heatsink
VL-COMm-26ECK Atom E680T 1.6 GHz 1 GB Heatsink
VL-COMm-26EDK* Atom E680T 1.6 GHz 2 GB Heatsink
* Special order

Accessories

Part Number Description
Carrier Boards
VL-BBm-10E-xxxx Carrier board, 5 mm board spacing, AUX connector, Class 2
Solid-State Storage (Flash Memory)
VL-F41-xxxx microSD card (SDIO), SLC, industrial temp.
Hardware
VL-HDW-405 Secondary mounting plate. Simplifies installation in many situations. Attaches to heat plate models.
Miscellaneous
VL-HDW-401 Thermal compound paste (1.75g)
Questions? / Product Selection / Technical Assistance
Specifications
General Form Factor COM Express mini (Type 10): 55 mm x 84 mm (2.17 x 3.31)
Processor Intel Atom E6x0T platform. 512K 8-way L2 cache. Intel Hyper-Threading Technology (HT), Virtualization Technology (VT), Enhanced SpeedStep Technology, Thermal Monitoring Technologies, and Execute Disable Bit.
Chipset Intel EG20T Platform Controller Hub (PCH)
Battery Connection for 3.0V RTC backup battery
Power Requirements (@ +12V)
Model Idle Typical Max. S3
VL-COMm-26EAx 7.2W 7.4W 7.6W 3.0W
VL-COMm-26EBx 7.3W 8.0W 8.7W 3.0W
VL-COMm-26ECx 7.3W 8.4W 9.5W 3.0W
VL-COMm-26EDx 7.3W 8.4W 9.5W 3.0W
Input Voltage 8V17V (nominal 12V operation)
System Reset & Hardware Monitors All voltage rails monitored. Watchdog timer with programmable timeout (1 S to 10 min.).
Manufacturing Standards
Standard IPC-A-610 Class 2
Custom IPC-A-610 Class 3 (modified)
Regulatory Compliance RoHS compliant
Environmental Operating Temperature -40 to +85C. Derate -1.1C per 305m (1,000 ft.) above 2,300m (7,500 ft.).
Storage Temperature -40 to +85C
Cooling Fanless. Heatsink or bolt-down heat plate.
Airflow Requirements
Model Temp. Range Airflow
Heat plate models -40 to +85C
Heat plate must be kept below 90C
Zero airflow
Heatsink models -40 to +60C Zero airflow
+60 to +85C 300 LFM
Altitude
Operating To 15,000 ft. (4,570m)
Storage To 40,000 ft. (12,000m)
Thermal Shock 5C/min. over operating temperature
Humidity Less than 95%, noncondensing
Vibration, Sinusoidal Sweep MIL-STD-202G, Method 204, Modified Condition A: 2g constant acceleration from 5 to 500 Hz, 20 min. per axis
Vibration, Random MIL-STD-202G, Method 214A, Condition A: 5.35g rms, 5 min. per axis
Mechanical Shock MIL-STD-202G, Method 213B, Condition G: 20g half-sine, 11 msec. duration per axis
Security TPM (optional) Support for Intel Trusted Platform Module 1.2 devices
Memory System RAM Up to 2 GB soldered-on DDR2 SDRAM. 800 MT/s.
Video General Intel GMA600 high-performance graphics core. Advanced 2D/3D graphics. Hardware-accelerated video encode and decode.
VRAM Up to 256 MB + 384 MB shared DRAM
Desktop Display Interface SDVO supports a variety of signaling interfaces including VGA and DVI. Up to 1920 x 1080 (50 Hz) or 1280 x 1024 (85 Hz).
OEM Flat Panel Interface Single-channel LVDS interface. 18/24-bit. Up to 1280 x 768 (60 Hz).
Mass Storage Rotating Drives / Flash / Solid-State Drives Two SATA 3 Gb/s ports
microSD socket supports up to 32 GB. SDIO interface supports SD, SDIO, and MMC.
Network Interface Ethernet One autodetect 10BaseT/100BaseTX/1000BaseT port. Network boot option.
Type 10 I/O Interfaces USB Six host and one client USB 2.0 ports
COM 3 / 4 # CMOS levels. 16C550 compatible. 1 Mbps max.
Audio Intel High-Definition Audio (HDA) CODEC
PCIe Three x1 PCIe (Gen 1) lanes
SMBus 1 MHz
LPC 33 MHz
Control Wake, reset, and power
Auxiliary I/O Interfaces CAN 2-wire CAN port
COM 1 # CMOS levels. 16C550 compatible. 1 Mbps max. Handshake lines.
COM 2 # CMOS levels. 16C550 compatible. 1 Mbps max.
Software BIOS AMI Aptio UEFI BIOS with OEM enhancements. Field reprogrammable.
Sleep Mode ACPI 3.0. Support for S3 suspend state.
Operating Systems Compatible with most x86 operating systems including Windows, Windows Embedded, Linux, and VxWorks
Represents operation at +25C and +12V supply running Windows XP with LVDS display, SATA, GbE, COM, and USB keyboard/mouse. Typical power computed as the mean value of Idle and Maximum power specifications. Maximum power measured with 95% CPU utilization.
 IEEE 1588 Precision Time Protocol (PTP) compatible
 Bootable storage device
 Available via Type 10 I/O connector
Extended altitude specifications available upon request
# COM1 and COM2 ports are available only when the auxiliary board-to-board connector is used
MIL-STD-202G shock and vibe levels are used to illustrate the extreme ruggedness of this product in general. Testing to higher levels and/or different types of shock or vibration methods can be accommodated per the specific requirements of the application. Contact a VersaLogic Sales Engineer for further information.
Specifications are subject to change without notification. Intel and Atom are trademarks of Intel Corp. COM Express is a trademark of PICMG. PCI Express is a registered trademark of PCI-SIG. microSD is a trademark of SD-3C, LLC. All other trademarks are the property of their respective owners.